Publications of M. Zhao

Zhao, M.; Chankin, A.; Coster, D.: An iterative algorithm of coupling the Kinetic Code for Plasma Periphery (KIPP) with SOLPS. Computer Physics Communications 235, pp. 133 - 152 (2019)

Zhao, M.; Chankin, A.; Coster, D.: SOLPS simulations with electron kinetic effects. Plasma Physics and Controlled Fusion 61, 025019 (2019)

Zhao, M.; Chankin, A. V.; Coster, D. P.: Implementation of an inelastic collision operator into KIPP‐SOLPS coupling and its effects on electron parallel transport in the scrape‐off layer plasmas. Contributions to Plasma Physics 59 (7), e201800130 (2019)

Zhao, M.; Jacob, W.; Gao, L.; Manhard, A.; Dürbeck, T.; Zhou, Z.: Deuterium retention behavior of pure and Y₂O₃-doped tungsten investigated by nuclear reaction analysis and thermal desorption spectroscopy. Nuclear Materials and Energy 15, pp. 32 - 42 (2018)

Zhao, M.; Chankin, A. V.; Coster, D. P.: Kinetic simulations of electron heat flux in the scrape-off layer. Nuclear Materials and Energy 12, pp. 819 - 824 (2017)

Zhao, M.; Jacob, W.; Manhard, A.; Gao, L.; Balden, M.; Toussaint, U. v.; Zhou, Z.: Deuterium implantation into Y₂O₃-doped and pure tungsten: Deuterium retention and blistering behavior. Journal of Nuclear Materials 487, pp. 75 - 83 (2017)

Zhao, M.; Chankin, A. V.; Coster, D. P.: Kinetic simulations of electron heat flux in the scrape-off layer. 22nd International Conference on Plasma Surface Interactions in Controlled Fusion Devices (PSI 22), Rome (submitted)

Zhao, M.; Chankin, A.; Coster, D.: Kinetic Simulations of 1D SOL Plasmas with KIPP-SOLPS Coupling Code. DPG-Frühjahrstagung der Sektion Materie und Kosmos (SMuK), Bremen (submitted)

Zhao, M.: Towards a More Complete Description of Tokamak Edge Plasmas: SOLPS Simulations with Kinetic Electron Effects. Dissertation, 143 pp., Technische Universität München, München (2018)

Zhao, M.: Towards a More Complete Description of Tokamak Edge Plasmas: SOLPS Simulations with Kinetic Electron Effects. Max-Planck-Institut für Plasmaphysik, Garching (2018), 137 pp.